Overview
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Ultra-high fin density capability
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Integral fin construction
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Superior thermal performance
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Minimal thermal resistance
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Ideal for high-power applications
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Space-efficient design
Technical Specifications
Material Properties
- • Base Material: Copper/Aluminum
- • Thermal Conductivity: Up to 400 W/m·K
- • Surface Treatment: Nickel/Gold Plating
- • Material Purity: 99.9%
- • Tensile Strength: Variable by material
Dimensional Capabilities
- • Fin Height: 0.5-50mm
- • Fin Thickness: 0.1-0.5mm
- • Fin Density: Up to 40 FPI
- • Base Thickness: 2-20mm
- • Surface Finish: Ra 0.8-3.2
Thermal Performance
- • Thermal Resistance: 0.2-1.0°C/W
- • Max Heat Dissipation: 800W
- • Operating Temp: -40°C to +200°C
- • Air Velocity Range: 200-1000 LFM
- • Typical ΔT: 25-45°C
Applications
High-Performance Computing
- • CPU Cooling
- • GPU Cooling
- • Memory Cooling
- • Server Components
- • Workstation Systems
Power Electronics
- • IGBT Modules
- • Power Converters
- • Motor Controllers
- • Solid State Drives
- • RF Amplifiers
Telecommunications
- • 5G Equipment
- • Base Stations
- • Network Switches
- • Optical Transceivers
- • Signal Amplifiers
Design & Engineering Services
Thermal Engineering
- • Fin Optimization
- • CFD Analysis
- • Thermal Resistance Analysis
- • Material Selection
- • Performance Modeling
Manufacturing Process
- • Skiving Parameter Optimization
- • Tool Design
- • Surface Treatment
- • Quality Control
- • Process Validation
Testing & Validation
- • Thermal Performance Testing
- • Mechanical Strength Testing
- • Reliability Testing
- • Environmental Testing
- • Documentation
Need a Custom Heat Sink Solution?
Contact our engineering team for custom heat sink design and manufacturing.
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