Overview
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Modular design approach
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Scalable thermal solution
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Flexible configuration
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Easy maintenance
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Optimized airflow
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Customizable capacity
Technical Specifications
Design Parameters
- • Module Size: 50-200mm
- • Stack Height: Up to 500mm
- • Layer Spacing: 2-10mm
- • Interface Type: Mechanical/Thermal
- • Assembly Method: Clip/Screw
Construction Details
- • Materials: Al/Cu Combinations
- • Surface Treatment: Anodized/Plated
- • Interface Material: TIM/Paste
- • Connection Type: Interlocking/Fastened
- • Module Count: 2-10 typical
Thermal Properties
- • Per Module Resistance: 0.5-2.0°C/W
- • System Capacity: Up to 1500W
- • Operating Range: -40°C to +150°C
- • Airflow Pattern: Vertical/Horizontal
- • Stack Efficiency: 85-95%
Applications
Data Centers
- • Server Cooling
- • Network Equipment
- • Storage Systems
- • Power Distribution
- • Telecom Equipment
Industrial Systems
- • Power Electronics
- • Motor Controls
- • Industrial PCs
- • Process Equipment
- • Automation Systems
Power Generation
- • Inverter Systems
- • Power Converters
- • Battery Systems
- • Control Equipment
- • Monitoring Systems
Design & Engineering Services
System Design
- • Thermal Requirements
- • Module Configuration
- • Airflow Analysis
- • Interface Design
- • Performance Optimization
Assembly Engineering
- • Stack Configuration
- • Interface Selection
- • Assembly Process
- • Quality Control
- • Testing Procedures
Performance Validation
- • Thermal Testing
- • Airflow Testing
- • Mechanical Testing
- • Reliability Testing
- • System Integration
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