Overview
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Enhanced material structure through forging
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Superior thermal conductivity
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High mechanical strength
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Complex geometry capabilities
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Excellent surface finish
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Optimized grain structure
Technical Specifications
Material Properties
- • Base Material: Aluminum/Copper
- • Enhanced Conductivity: +15-20%
- • Surface Finish: Ra 0.8-3.2
- • Hardness: 80-150 HB
- • Grain Structure: Refined
Manufacturing Capabilities
- • Size Range: 10-250mm
- • Minimum Wall: 1.5mm
- • Maximum Height: 100mm
- • Tolerance: ±0.1mm
- • Draft Angle: 1-3°
Performance Specs
- • Thermal Resistance: 0.2-1.5°C/W
- • Power Handling: Up to 800W
- • Temperature Range: -40°C to +180°C
- • Pressure Rating: Up to 2MPa
- • Lifetime: >100,000 hours
Applications
High-Performance Computing
- • Server Processors
- • Gaming Systems
- • Workstations
- • Data Centers
- • AI Accelerators
Power Electronics
- • Power Converters
- • Industrial Drives
- • UPS Systems
- • Railway Equipment
- • Electric Vehicles
Military & Aerospace
- • Radar Systems
- • Communication Equipment
- • Navigation Systems
- • Power Supplies
- • Electronic Warfare
Design & Engineering Services
Engineering Analysis
- • FEA Simulation
- • Material Flow Analysis
- • Thermal Optimization
- • Structural Analysis
- • Design Validation
Process Development
- • Forging Parameters
- • Tool Design
- • Process Control
- • Quality Assurance
- • Cost Optimization
Quality Control
- • Material Testing
- • Dimensional Inspection
- • Performance Testing
- • Surface Analysis
- • Documentation
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