Overview
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Multi-material construction
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Optimized thermal performance
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Custom material combinations
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High reliability bonding
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Flexible design options
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Cost-effective solution
Technical Specifications
Material Combinations
- • Base: Copper/Aluminum
- • Fins: Aluminum/Copper
- • Bond Type: Thermal Epoxy/Solder
- • Interface Resistance: <0.1°C/W
- • Bond Strength: >1000 PSI
Design Parameters
- • Base Size: Up to 300mm
- • Fin Height: 5-150mm
- • Fin Thickness: 0.3-2.0mm
- • Base Thickness: 3-20mm
- • Assembly Tolerance: ±0.2mm
Thermal Characteristics
- • Thermal Resistance: 0.3-2.0°C/W
- • Power Capacity: Up to 600W
- • Operating Range: -40°C to +150°C
- • Bond Thermal Resistance: <0.05°C/W
- • Temperature Cycling: -40°C to +150°C
Applications
Power Electronics
- • IGBT Modules
- • Power Supplies
- • Motor Drives
- • Solar Inverters
- • EV Charging
Computing
- • High-End CPUs
- • Graphics Cards
- • Memory Systems
- • Network Equipment
- • Storage Systems
Industrial
- • Process Control
- • Automation Systems
- • Power Distribution
- • Machine Tools
- • Welding Equipment
Design & Engineering Services
Material Engineering
- • Material Selection
- • Interface Design
- • Thermal Analysis
- • Reliability Testing
- • Cost Optimization
Manufacturing Process
- • Bonding Process Design
- • Quality Control
- • Process Validation
- • Assembly Optimization
- • Production Planning
Testing Services
- • Bond Strength Testing
- • Thermal Performance
- • Environmental Testing
- • Reliability Testing
- • Failure Analysis
Need a Custom Heat Sink Solution?
Contact our engineering team for custom heat sink design and manufacturing.
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