Overview
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Precise assembly process
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Excellent thermal interface
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Multiple solder options
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Reworkable connections
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Cost-effective joining
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Automated assembly capable
Technical Specifications
Soldering Parameters
- • Solder Types: Lead-free/SAC305
- • Process Temp: 217-250°C
- • Joint Thickness: 50-200μm
- • Void Content: <5%
- • Wetting Angle: <30°
Assembly Specifications
- • Component Size: 5-200mm
- • Placement Accuracy: ±0.1mm
- • Temperature Control: ±2°C
- • Flux Types: No-clean/Water-soluble
- • Production Rate: Up to 300/hour
Performance Metrics
- • Thermal Resistance: 0.2-1.5°C/W
- • Shear Strength: >1000 PSI
- • Temperature Range: -40°C to +125°C
- • Thermal Cycles: >1000
- • Expected Life: 5-10 years
Applications
Electronics Assembly
- • PCB Assembly
- • Component Cooling
- • LED Modules
- • Power Supplies
- • RF Components
Consumer Products
- • Computer Hardware
- • Gaming Consoles
- • Audio Equipment
- • Network Devices
- • Display Systems
Industrial Electronics
- • Control Systems
- • Sensor Assemblies
- • Power Modules
- • Drive Components
- • Automation Equipment
Design & Engineering Services
Process Development
- • Solder Selection
- • Profile Development
- • Fixture Design
- • Process Control
- • Quality Parameters
Manufacturing Support
- • Production Setup
- • Process Optimization
- • Quality Control
- • Operator Training
- • Documentation
Quality Assurance
- • Visual Inspection
- • X-Ray Inspection
- • Pull Testing
- • Thermal Testing
- • Reliability Testing
Need a Custom Heat Sink Solution?
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