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Copper Heat Sink
Superior thermal performance for demanding applications
Overview
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Premium C11000/C12200 copper construction
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Thermal conductivity: 380-400 W/m·K
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Superior heat spreading capability
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Nickel plating option for corrosion resistance
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Ideal for high-power density applications
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Maximum thermal performance
Technical Specifications
Material Properties
- • Copper Grade: C11000, C12200
- • Thermal Conductivity: 380-400 W/m·K
- • Surface Treatment: Nickel Plating
- • Density: 8.96 g/cm³
- • Tensile Strength: 220 MPa
Dimensional Capabilities
- • Base Thickness: 2-25mm
- • Fin Height: Up to 100mm
- • Fin Thickness: 0.5-2.0mm
- • Surface Flatness: ±0.02mm
- • Standard Tolerances: ±0.05mm
Thermal Performance
- • Thermal Resistance: 0.1-0.5°C/W
- • Max Heat Dissipation: 1000W
- • Operating Temp: -40°C to +180°C
- • Recommended Airflow: 200-800 LFM
- • Typical ΔT: 20-40°C
Common Applications
High-Performance Computing
- • Server CPUs
- • Graphics Cards
- • Data Center Equipment
- • High-End Workstations
- • Cryptocurrency Mining
Power Electronics
- • IGBT Modules
- • Power Inverters
- • RF Power Amplifiers
- • High-Power LEDs
- • Military Electronics
Research Equipment
- • Laser Systems
- • Scientific Instruments
- • Laboratory Equipment
- • Particle Accelerators
- • Testing Equipment
Design & Engineering Services
Advanced Thermal Analysis
- • 3D Thermal Modeling
- • Heat Spreading Analysis
- • Interface Optimization
- • Thermal Bottleneck Analysis
- • System Integration
Precision Manufacturing
- • High-Precision Machining
- • Surface Treatment Process
- • Assembly Optimization
- • Quality Assurance
- • Process Validation
Performance Validation
- • Thermal Imaging Analysis
- • Load Testing
- • Reliability Testing
- • Environmental Stress Testing
- • Long-term Performance Monitoring
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Ready to Optimize Your Thermal Management?
Contact our engineering team to discuss your heat sink requirements and get expert consultation.